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Rapidus secures $3.9 billion in government funding for 2nm and multi-chiplet technologies

Japanese company Rapidus is working on developing 2nm process technology with plans to launch it commercially in 2027. The company has received a substantial grant of ¥590 billion yen ($3.89 billion) from the Japanese government to support its ongoing projects. This funding will go towards developing the 2nm production node, purchasing cleanroom equipment, and multi-chiplet packaging technology.

Rapidus CEO Atsuyoshi Koike has outlined the company’s timeline, with plans to initiate testing of its production by April 2025 and hopes for large-scale production to begin by 2027. Commercial production of 2nm chips is expected to kick off in 2025.

In addition to working on the 2nm fabrication process in partnership with IBM and constructing its manufacturing facility, Rapidus is also focusing on advanced packaging technology for multi-chiplet System-in-Packages (SiPs). The recent government subsidies include more than ¥50 billion ($329.85 million) specifically allocated for research and development in this area, marking the first time Japan has offered subsidies for such technologies.

Another interesting development is Rapidus’s use of a portion of Seiko Epson Corporation’s Chitose Plant, located in Chitose City, Hokkaido, for its back-end packaging processes. This facility is in close proximity to the company’s fab currently under construction in Bibi World, an industrial park in Chitose City, slated for use in pilot-stage research and development activities.

By Samantha Jones

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